Tudip Technologies Interview Experience for Software Engineer
I applied to this company via a college placement
INTERVIEW PROCESS :
- First round:- Aptitude round
- Second round:- Technical round(Code)
- Third round:- Pen paper round
- Fourth round:- Technical round and HR (Final)
Aptitude Round:
- This round consists of 30 MCQ Questions
- 20 Aptitude or 10 Technical Questions
- Timing 30 min means per question 1 min
Note:
They circulate a Google form in which you must type your code not provide any ID or compiler to test whether your code is correct or not..!
Technical Round(Code):
- The second round is a coding round which consists of 3 questions
- If num > 41 then print foo if num>43 then print baar if num > 41 and num >43 print foobaar
- The third largest number from an array
- Print factorial program
Pen paper round:
- This round consists of 2 sets
Set 1:
- Find duplicate items in the string
- Find distinct character count from string example (abcdABCDabcd)
Set 2:
- Find whether the given array is palindrome or not
- Find duplicate items from the given array
Technical Round + Hr:
- Tell me about yourself
- Role in your Project
- Primary key vs foreign key
- Cube of 7
- 80 % of 70
- 200% of 100
- He saw a printer and assigned me a task to find the area of this printer
- Which technology would you choose if you get a chance to work with us frontend or backend
- Newton’s First, second, and third law
- Chemistry question:- si full form (Silica), o full form(Oxygen)
- Explain the questions which you write in pen paper round and provide me 2 more approach
- You win a first price in fireless cooking then tell me the recipe you make
- What is fireless cooking
- 625 square root
- Why should we hire you
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